LED PRINT HEAD

Overview

Our GaAsP wafer process technology is used to make 740nm LED print heads which are made into finished products by using the wire bonding technology we have developed and improved for many years. Our print heads can print in resolutions 600dpi on A4 and larger paper.
Customized development for high performance and high end product is our main LPH business scope.

Fatures

  • Compact
  • High reliability
  • Easy to adjust
  • High radiance luminous efficacy LED
  • For custom

Applications

  • LED printers
  • Facsimiles

Characteristic

SPECIFICATION
Print width mm 926.5(Max)
Dot density dots/inch 600
Dot pitch μm 42.3
STANDARD OPERATING CONDITIONS
Supply voltage VDD(V) 4.75(Min),5.0
(Typ),5.25(Max)
ORTICAL CHARACTERISTICS
Dominant Wavelength λp(nm) 740±10
Average light power Po(μW/dot) VDD=5.0V 4(Max)
Range of Max -Min light power ΔPo(%) ±3%

※Ta=25℃

※*VCC=5V