Our GaAsP wafer process technology is used to make 740nm LED print heads which are made into finished products by using the wire bonding technology we have developed and improved for many years. Our print heads can print in resolutions from 200dpi to 600dpi on A4 and larger paper.
Customized development for high performance and high end product is our main LPH business scope.
|Print width mm||0〜926.5(Max)|
|Dot density dots/inch||200, 400, 600|
|Dot pitch μm||127, 63.5, 42.3, 21.2|
|STANDARD OPERATING CONDITIONS|
|4.75(Min), 5.0(Typ), 5.25(Max)|
|Dominant Wavelength λp(nm)||740±10|
|Average light power
|Range of Max -Min light power
● High reliability
●Easy to adjust
●High radiance luminous efficacy LED