Sensor/Opto component/module

Print

LED Print Head

Our GaAsP wafer process technology is used to make 740nm LED print heads which are made into finished products by using the wire bonding technology we have developed and improved for many years. Our print heads can print in resolutions from 200dpi to 600dpi on A4 and larger paper.
Customized development for high performance and high end product is our main LPH business scope.

■Features
Ta=25°C

SPECIFICATION
Print width mm 0〜926.5(Max)
Dot density dots/inch 200, 400, 600
Dot pitch μm 127, 63.5, 42.3, 21.2
STANDARD OPERATING CONDITIONS
Supply voltage
VDD(V)
4.75(Min), 5.0(Typ), 5.25(Max)
ORTICAL CHARACTERISTICS
Dominant Wavelength λp(nm) 740±10
Average light power
Po(μW/dot)
VDD=5.0V
4(Max)
Range of Max -Min light power
ΔPo(%)
±3%

■FEATURES

●Compact
● High reliability
●Easy to adjust
●High radiance luminous efficacy LED
●For custom

■APPLICATIONS

●LED printers
● Facsimiles

Kodenshi with visual images

Environmental Policy

RoHS DIRECTIVE COMPLIANCE

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