Sensor/Opto component/module
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- Sensor/Opto component/module
-
- Photointerrupter
- Paper Sensor
- Manuscript Size Sensor
- Human body detecetion sensor
- Photo-IC for printing timing detection
- Infrared range finding Sensors
- Optical digital encoder
Our GaAsP wafer process technology is used to make 740nm LED print heads which are made into finished products by using the wire bonding technology we have developed and improved for many years. Our print heads can print in resolutions from 200dpi to 1200dpi on A4 and larger paper.
Customized development for high performance and high end product is our main LPH business scope.
■Features
Ta=25°C
| SPECIFICATION | |
|---|---|
| Print width mm | 0〜926.5(Max) |
| Dot density dots/inch | 200, 400, 600, 1200 |
| Dot pitch μm | 127, 63.5, 42.3, 21.2 |
| STANDARD OPERATING CONDITIONS | |
| Supply voltage VDD(V) |
4.75(Min), 5.0(Typ), 5.25(Max) |
| ORTICAL CHARACTERISTICS | |
| Dominant Wavelength λp(nm) | 740±10 |
| Average light power Po(μW/dot) VDD=5.0V |
4(Max) |
| Range of Max -Min light power ΔPo(%) |
±3% |
■FEATURES
●Compact
● High reliability
●Easy to adjust
●High radiance luminous efficacy LED
●For custom
■APPLICATIONS
●LED printers
● Facsimiles
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