Opto semiconductor element

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Photodiode chip

The photodiodes used in optical encoders and photodiode arrays are mostly attached directly to the printed circuit board with adhesive. KODENSHI responds to the individual customers needs for these types of photodiodes. For example by making arbitrarily sized photo detector sufaces , we provide a wide variety of products in lots to meet customer's need.

Photodiode chip HPI series

■Features
Ta=25°C

Type No. Open
circuit
voltage
Voc(V)
Typ.
Short
cricuit
current
Ev=1000lx
Isc(μA)
Typ.
Collector
dark
current
(nA)
VR=10V
Max.
Capacitance
Ct(pF)
VR=0V
Spectral
sensitivity
(nm)
Sensitivity
(A/W)
Typ.
Peak
wavelength
λP(nm)
Typ.
Typ.
HPI-07N pdf[163KB] 0.4 2.4 20 6 450∼1050 0.55
λ=780nm
900
HPI-12N pdf[165KB] 0.4 7.5 20 13 450∼1050 0.55
λ=780nm
900
HPI-16 pdf[163KB] 0.4 17 20 16 450∼1050 0.55
λ=780nm
910
HPI-20 pdf[163KB] 0.4 28 20 24 450∼1050 0.6
λ=880nm
950
HPI-30N pdf[164KB] 0.4 65 20 94 450∼1050 0.6
λ=880nm
940
  • Kodenshi can make into Photo-diode-array by Photo-diode-chips with your specification.
  • Kodenshi can develop photo-diode detecting area with your specification.
  • Kodenshi can produce PHOTO-IC which make photo-diode detecting area and circuit one chip.
  • With your specification, Kodenshi can develop hybrid-IC buit-in photo-diode chip and photo-IC.

Photodiode chip SP series

■Features
Ta=25°C

Type No. Open
circuit
voltage
Voc(V)
Typ.
Short
cricuit
current
Ev=1000lx
Isc(μA)
Typ.
Spectral
Sensitivity
λ(nm)
Typ.
Peak
wavelength
λP
Typ.
SP-1-AU 0.41 23 420∼1100 900
SP-10-AU 0.41 620 420∼1100 900
SP-19-AU 0.41 32 420∼1100 900
SP-113-AU 0.41 1300 420∼1100 900
SP-2-AU 0.41 25 420∼1100 900
SP-254-AU 0.41 52 420∼1100 900
SP-26-AU 0.41 88 420∼1100 900
SP-27-AU 0.41 85 420∼1100 900
SP-30-AU 0.41 175 420∼1100 900
SP-4-AU 0.41 96 420∼1100 900
SP-45-AU 0.41 120 420∼1100 900
SP-55-AU 0.41 145 420∼1100 900
SP-550-AU 0.41 125 420∼1100 900
SP-651-AU 0.41 360 420∼1100 900
SP-652-AU 0.41 680 420∼1100 900

Kodenshi can provide composite devices which are assembled, not bare chip by itself.

  • Kodenshi can make into Photo-diode-array by Photo-diode-chips with your specification.
  • With your specification, Kodenshi can develop hybrid-IC buit-in photo-diode chip and photo-IC.
  • It is incapable to put reverse voltage.

Kodenshi with visual images

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