Kodenshi has accumulated experiences for development on optical semiconductor for many years. We have handled Solid processing (MEMS) of silicon, and achieved to release some products into the market.
We can offer various specifications for a solid processing of silicon, basing on the experience for customized specifications to meet the demand of the customers.
The features of MEMS technology by Kodenshi are as follows;
(1)V ditch processing accuracy 1.0μm or less
(2)Possession of "Dry etching technology" and "Wet etching technology"
and the compound technology of "Dry wet etching for silicon crystal unisometric etching technology.
We are well prepared by these technologies corresponding to various demands of the customers!
|Silicon crystal unisometric etching technology||SiOB and optical pass|
|Silicon dry etching technology||Micro TAS and micro machining|
|Silicon wet etching technology||Micro TAS and micro machining|
|Silicon dry wet etching compound technology||Micro TAS and micro machining|
|Diamond Fullum formation technology||Flow sensor and pressure sensor|
|The silicon glass joint technology||Various sensors|
|Technology of process of the glass||Electrostatic capacity sensor and flow cell|
|Minute electroformed processing technology||Minute metal mold|
|Minute reproduction molding technology||Optical pass and lens for optical communication|
The MEMS technology of Kodenshi is made the best use of in customer's specification. Please do not hesitate to inquire details.
You will find a KODENSHI MEMS technology that is really close to what you are looking for.To find out more about KODENSHI custom product development capabilities,please contact us.KODENSHI is always at your service.